TDI (time delay and integration) is a popular line scanning technique for applications such us as remote sensing, precision agriculture and machine vision in industrial environments. TDI is often achieved by CCD (charged-coupled device) technology, which traditionally required a board with multiple chips.
Imec managed to develop a solution that combines CCD pixels with CMOS readout into one technology. This combines the best of two worlds:
- highly sensitive TDI
- high level of integration
When spectral filters are deposited on top of these imagers, this results in fast hyperspectral imaging solutions with a high signal-to-noise ratio.
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17 March 2017